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Two causes of source/drain series resistance in bottom-contact pentacene thin-film transistors

机译:底部接触并五苯薄膜晶体管源/漏串联电阻的两个原因

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We identified two causes of source/drain (S/D) series resistance (Rs) in bottom-contact (BC) pentancene thin-film transistors (TFTs). One is mixed-phase pentacene grown in the blurred-edge region of Au electrodes and the other is the semi-insulating pentacene region between the Au electrode and the carrier-accumulating layer. A novel Au S/D electrode structure with a self-assembled monolayer (SAM) adhesion layer enables direct injection of carriers into the accumulating layer and markedly reduces Rs for unit gate width (RsW) to 6 MΩ μm. BC TFTs with this electrode structure showed extrinsic field-effect mobility as high as 1.1 cm~2/Vs.
机译:我们确定了底接触(BC)戊烯薄膜晶体管(TFT)中源/漏(S / D)串联电阻(Rs)的两个原因。一种是在金电极的模糊边缘区域中生长的混合相并五苯,另一种是金电极和载流子积累层之间的半绝缘并五苯区域。具有自组装单层(SAM)粘附层的新型Au S / D电极结构可将载流子直接注入积聚层,并将单位栅宽(RsW)的Rs显着降低至6MΩμm。具有这种电极结构的BC TFT表现出的外部场效应迁移率高达1.1 cm〜2 / Vs。

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