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EFFECTIVE MANAGEMENT OF PROCESS EXHAUST FROM LOW-K CVD PROCESSES

机译:低K CVD过程的过程排放的有效管理

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摘要

Because the development of low k films by CVD processes utilizes novel precursors, careful consideration must be given to abatement of the exhaust products from these processes. Incineration is rapidly gaining acceptance in this role, although simple burning techniques often fall short of meeting abatement requirements. Low k CVD precursors are difficult to burn cleanly and require adequate O_2 for complete combustion. Also, using NF_3 for in situ chamber cleans generates F_2 and HF, which amplify abatement requirements. A study was done to determine the abatement requirements of both the deposition and the chamber clean steps of the low k CVD process. An optimized point of use (POU) combustor / scrubber device showed > 99% destruction removal efficiency (DRE) of all precursors tested using either compressed dry air (CDA) or O_2 as appropriate. The device was also optimized for quantitative removal of NF_3 and F_2 from the chamber clean.
机译:由于通过CVD工艺开发的低k膜利用了新型前驱物,因此必须认真考虑消除这些工艺产生的废气。尽管简单的燃烧技术通常无法满足减排要求,但焚化正迅速被人们接受。低k CVD的前驱物难以干净燃烧,并且需要足够的O_2才能完全燃烧。此外,使用NF_3进行原位腔室清洁会生成F_2和HF,这会增加减排要求。进行了一项研究以确定低k CVD工艺的沉积和腔室清洁步骤的减排要求。优化的使用点(POU)燃烧器/洗涤器装置显示,使用压缩干燥空气(CDA)或适当地使用O_2测试的所有前驱物,其销毁去除效率(DRE)均大于99%。该设备还进行了优化,可从腔室清洁剂中定量去除NF_3和F_2。

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