首页> 外文会议>Fifteenth International Symposium on Chemical Vapor Deposition, May 14-18, 2000, Toronto, Ontario >Nanocrystals Formation and Microstructure Evolution of Amorphous Si and Si_(0.7)Ge_(0.3) by Using Low Pressure Chemical Vapor Deposition
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Nanocrystals Formation and Microstructure Evolution of Amorphous Si and Si_(0.7)Ge_(0.3) by Using Low Pressure Chemical Vapor Deposition

机译:低压化学气相沉积法制备非晶态Si和Si_(0.7)Ge_(0.3)的纳米晶体及其组织演变

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The initial stage of amorphous film deposition of Si and Si_(0.7)Ge_(0.3) deposited on SiO_2 by low-pressure chemical vapor deposition (LPCVD) was evaluated. The experimental results show that the surface roughness of amorphous Si or Si_(0.7)Ge_(0.3) layer deposited at higher temperature is smaller than that at lower temperature in the temperature range from 375 to 450℃. Also, amorphous Si or Si_(0.7)Ge_(0.3) film with the thickness of about 5 nm can be deposited as islands rather than continuous film, which is dependent on deposition temperature. In this paper, the islands formation at the initial stage of amorphous Si or Si_(0.7)Ge_(0.3)deposition was explained with the nuclealion and growth behavior in LPCVD process in the viewpoint of thermodynamics and kinetics. The thermodynamic driving force for Si nucleation in LPCVD was calculated with the degree of supersaturation defined by the ratio of Si vapor pressure in the gas phase equilibrium stale to Si vapor pressure in the overall equilibrium state. In our experimental condition, the driving force is higher at higher deposition temperature in the temperature range below 800 K. which is the temperature range for amorphous film deposition. Besides of the calculation of thermodynamic driving force, mechanism of adatom attachment was considered. The mechanism of adatoms attachment was explained with the preferential deposition on deposited Si or Si_(0.7)Ge_(0.3) cluster rather than on SiO_2 substrate. Also, the dependency of surface roughness on deposition was explained with preferential deposition and surface coverage effect.
机译:评估了通过低压化学气相沉积(LPCVD)沉积在SiO_2上的Si和Si_(0.7)Ge_(0.3)的非晶膜沉积的初始阶段。实验结果表明,在375〜450℃温度范围内,较高温度下沉积的非晶Si或Si_(0.7)Ge_(0.3)层的表面粗糙度小于较低温度下的表面粗糙度。而且,取决于沉积温度,可以沉积具有岛状而不是连续膜的约5nm厚度的非晶Si或Si_(0.7)Ge_(0.3)膜。本文从热力学和动力学的角度解释了LPCVD工艺中成核或生长行为,解释了非晶硅或Si_(0.7)Ge_(0.3)沉积初期的岛形成。 LPCVD中Si成核的热力学驱动力是用过饱和度来计算的,该过饱和度由处于气相平衡状态的Si蒸气压与处于整体平衡状态的Si蒸气压之比定义。在我们的实验条件下,在高于800 K的温度范围内的较高沉积温度下,驱动力较高,这是非晶膜沉积的温度范围。除了计算热力学驱动力外,还考虑了吸附原子的机理。通过优先沉积在沉积的Si或Si_(0.7)Ge_(0.3)簇上而不是在SiO_2衬底上来解释吸附原子的机理。另外,通过优先的沉积和表面覆盖效应解释了表面粗糙度对沉积的依赖性。

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