首页> 外文会议>European Microwave Conference vol.3; 20041011-14; Amsterdam(NL) >Microwave Component Miniaturization by Local Embedding High-Permittivity Dielectric Materials in Low-Permittivity Substrates
【24h】

Microwave Component Miniaturization by Local Embedding High-Permittivity Dielectric Materials in Low-Permittivity Substrates

机译:通过在低介电常数基板中局部嵌入高介电常数介电材料来使微波组件小型化

获取原文
获取原文并翻译 | 示例

摘要

Local embedding of high-permittivity dielectric materials has been used for decreasing size and monitoring parameters of microstrip resonators and filters with low-permittivity substrates. Capacitive loads utilizing high permittivity dielectric inclusions or superstrate layers are placed in the structures at the locations defined from the analysis of electromagnetic field distribution at resonant frequencies. Full-wave electromagnetic simulations have been performed by the Finite Difference Time Domain (FDTD) method. The designs of compact microstrip resonators and filters have been developed and the prototypes fabricated by using the Low Temperature Co-fired Ceramic (LTCC) technology. The proposed approach demonstrates a new way for microwave component miniaturization and parameter optimization.
机译:高介电常数电介质材料的局部嵌入已用于减小尺寸并监视具有低介电常数基板的微带谐振器和滤波器的参数。利用高介电常数电介质夹杂物或上覆层的电容性负载放置在结构中的位置处,该位置是通过分析共振频率下的电磁场分布确定的。全波电磁仿真已通过有限时域(FDTD)方法执行。已经开发出了紧凑的微带谐振器和滤波器的设计,并通过使用低温共烧陶瓷(LTCC)技术制造了原型。所提出的方法展示了一种用于微波部件小型化和参数优化的新方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号