3D Chip Size Packaging for highly integrated memory cards for consumer-products

摘要

RMPD~R Rapid Manufacturing processes based on parallel manufacture of Microsystems and photo-polymerisation methods. Parallel means that many parts are manufactured simultaneously by generative production methods. The RMPD~R technologies, including 3D-CSP, are used for production of customer-specific production of polymer-based Microsystems (also called microelectronic mechanical systems - MEMS) and micro-parts. Based on microTEC's 3D-CSP method, silicon chips can be integrated into parallel structured packages and electrically connected without the need for serial processes, e.g. wire bonds. As a result of the processes working in parallel, this technology allows the cost-effective production of small memory cards (Smart cards). The batch-oriented process generates hundreds of memory cards simultaneously, as a result of which part costs are reduced. Moreover, 3D-CSP allows vertical integration of memory components (die-stacking), i.e. the storage capacity of a card can be increased simply by slacking and vertical interconnection of several memory components. The process opens up means of simply increasing the storage capacity of high-capacity memory cards. The successes in nanotechnology moreover enable scalable properties, e.g. with a view to mechanical, optical or fluidic use