School of Metallurgy and Resource, Anhui University of Technology, Ma'anshan, Anhui, 243002, PR China;
Department of Materials Science and Engineering, Delft University of Technology, Mekelweg 2, 2628 CD, Delft, The Netherlands;
Department of Materials Science and Engineering, Delft University of Technology, Mekelweg 2, 2628 CD, Delft, The Netherlands;
School of Metallurgy and Resource, Anhui University of Technology, Ma'anshan, Anhui, 243002, PR China;
Fibrous copper powder; Thermodynamic analysis; Coordination precipitation; Thermal decomposition; Conductive Filler;
机译:以改性BaTiO3粉为导电填料的抗静电涂料的制备与表征
机译:稀土改性医用石粉的制备及其作为导电填料的应用
机译:电纺石墨烯/丝素蛋白导电纤维支架的制备与表征
机译:用于导电填料的纤维铜粉的制备与表征
机译:具有连接的填充网络的高导热和导电复合材料:制备,表征和应用
机译:母料熔融法制备含碳填料的3D打印PLA基导电复合材料及其表征
机译:义齿基聚甲基丙烯酸甲酯填充剂的不透明牙瓷粉的制备与表征。