首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >A Multilayer Low Pass Filter Fabricated by Ferrite and Ceramic Cofiring System Based on LTCC Technology
【24h】

A Multilayer Low Pass Filter Fabricated by Ferrite and Ceramic Cofiring System Based on LTCC Technology

机译:基于LTCC技术的铁氧体和陶瓷共烧系统制造的多层低通滤波器

获取原文
获取原文并翻译 | 示例

摘要

LTCC (Low Temperature Co-fired Ceramics) has been become the key technology of packaging for the integrated of passive components due to its higher performance of thermal sink, reliability and plays an important role in increasing higher frequency, decreasing the loss, minimize the volume, etc. This paper mainly focuses on the design and fabrication of low pass filter based on ferrite and ceramic cofiring system by LTCC technology. Firstly, the match conditions of cofiring characteristics for ferrite and ceramic cofiring system were carefully studied by TMA measurement and the excellent shrinkage controlling was obtained. The low-pass filters with cut-off frequency at 120MHz were fabricated using Co/Ti doped barium ferrite and ULF140 material as the dielectrics to further validate the circuit model and the samples were tested with high consistence with the simulated data.
机译:LTCC(低温共烧陶瓷)由于具有更高的散热性能,可靠性而已成为集成无源元件的关键包装技术,并且在提高高频,减少损耗,最小化体积方面起着重要作用。本文主要研究基于LTCC技术的基于铁氧体和​​陶瓷共烧系统的低通滤波器的设计和制造。首先,通过TMA测量,仔细研究了铁素体与陶瓷共烧体系共烧特性的匹配条件,并获得了优异的收缩率控制。以钴/钛掺杂钡铁氧体和ULF140材料为电介质,制造了截止频率为120MHz的低通滤波器,以进一步验证电路模型,并与模拟数据进行了高度一致性的测试。

著录项

  • 来源
  • 会议地点 Beijing(CN)
  • 作者单位

    State Key Laboratory of Electronic Thin Film and Integrated DevicesUniversity of Electronic Science and Technology of China Chengdu, 610054, China;

    State Key Laboratory of Electronic Thin Film and Integrated DevicesUniversity of Electronic Science and Technology of China Chengdu, 610054, China;

    State Key Laboratory of Electronic Thin Film and Integrated DevicesUniversity of Electronic Science and Technology of China Chengdu, 610054, China;

    Institute of Astronautics and AeronauticsUniversity of Electronic Science and Technology of China Chengdu, 610054, China;

    Integrated microcircuit company of Anhui Province, Hefei, 230088, Anhui, China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号