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Foundry Platform Technology from High-Performance to Low-Power for New High-Performance Computing (HPC) and IoT Era

机译:适用于新型高性能计算(HPC)和物联网时代的从高性能到低功耗的铸造平台技术

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摘要

In this paper, “Foundry Platform” for coming new HPC/IoT era is introduced. Key features for the platform technology are (1) Easy migration with performance improvement, (2) Various special devices offering to serve different design purposes, such as ultra-low Vdd operation, extreme low leakage, RF and eNVM. Our platform technology can provide the best solution for a variety of products to enhance an overall chip performance.
机译:在本文中,介绍了即将到来的新HPC / IoT时代的“ Foundry平台”。该平台技术的主要特征是(1)易于移植并提高了性能;(2)提供各种服务于不同设计目的的特殊设备,例如超低Vdd操作,极低泄漏,RF和eNVM。我们的平台技术可以为各种产品提供最佳解决方案,以增强整体芯片性能。

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