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Research on the Optimization of Ni/Si Atomic Ratio for Cu-Ni-Si Alloys with High Strength and High Electrical Conductivity

机译:高强度高导电率的Cu-Ni-Si合金的Ni / Si原子比的优化研究

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Two sets of Cu-Ni-Si alloys with different Cu contents and Ni/Si atomic ratios were fabricated under the state of near-equilibrium solidification. The microstructures were observed by SEM and phase compositions were identified by XRD. The electrical conductivity and hardness were tested by Eddy-Conductivity Apparatus (ECA) and Digital Rockwell Hardmeter, respectively. The experimental results show that all the researched Cu-Ni-Si alloys are consisted of three phases, i.e. α-Cu(Ni,Si), Ni_3Si and δ-Ni_2Si. With the increase of Ni/Si atomic ratio, the amount of Ni_3Si decreases persistently but that of δ-Ni_2Si and electrical conductivity increases firstly and then decreases, the hardness decreases firstly and then increases following by a decrease finally. Both the electrical conductivity and hardness reach a relativity highest value when the Ni/Si atomic ratios are 2.6:1 and 2.4:1 for Cu-Ni-Si alloys with 95wt.% and 90wt.% Cu content respectively.
机译:在接近平衡凝固的状态下,制备了两组铜含量和Ni / Si原子比不同的Cu-Ni-Si合金。通过SEM观察微观结构,并通过XRD鉴定相组成。电导率和硬度分别通过涡流电导仪(ECA)和数字洛氏硬度计进行测试。实验结果表明,所研究的所有Cu-Ni-Si合金均由α-Cu(Ni,Si),Ni_3Si和δ-Ni_2Si这三个相组成。随着Ni / Si原子比的增加,Ni_3Si的含量持续减少,而δ-Ni_2Si的含量先增加,然后降低,电导率先降低,然后再降低。当Cu / Ni-Si合金的铜含量分别为95wt。%和90wt。%时,Ni / Si原子比为2.6:1和2.4:1时,电导率和硬度均达到相对最高值。

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