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A High Performance and Cost Effective Molded Array Package Substrate

机译：高性能，高性价比的模压阵列封装基板

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来源
《Device packaging 2010 》|2010年|p.1-5|共5页
会议地点 Scottsdale/Fountain Hills AZ(US)
作者
Philip Rogren; Pierangelo Magni; Maura Mazzola; Mark Shaw; Giovanni Graziosi; Claudio Maria Villa;
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作者单位

Eoplex Technologies 3698-A Haven Avenue Redwood City, CA 94063;

ST Microelectronics, Via C. Olivetti 2, 20041 Agrate Brianza, Italy;

ST Microelectronics, Via C. Olivetti 2, 20041 Agrate Brianza, Italy;

ST Microelectronics, Via C. Olivetti 2, 20041 Agrate Brianza, Italy;

ST Microelectronics, Via C. Olivetti 2, 20041 Agrate Brianza, Italy;

ST Microelectronics, Via C. Olivetti 2, 20041 Agrate Brianza, Italy;

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原文格式 PDF
正文语种 eng
中图分类制造工艺 ;
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1. Injection molded packaging is very cost effective [J] . Bernd Maienschein MM Industrial Magazine Western Europe . 2001 ,第3期

机译：注塑包装非常具有成本效益
2. Simple and cost-effective fabrication of microvalve arrays in PDMS using laser cut molds with application to C. elegans manipulation in microfluidics [J] . R. Samuel, C. M. Thacker, A. V. Maricq, Journal of Micromechanics and Microengineering . 2014 ,第10期

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3. Sensor suppliers look for high-performance, low-cost solutions in cost-effective packages [J] . Vladimir Vaganov, Harold Joseph, Steve Terry Instrumentation & Control System . 1997 ,第11期

机译：传感器供应商寻求经济高效的封装中的高性能，低成本解决方案
4. A High Performance and Cost Effective Molded Array Package Substrate [C] . Philip Rogren, Pierangelo Magni, Maura Mazzola, International Conference and Exhibition on Device Packaging . 2010

机译：高性能和经济高效的模制阵列封装基板
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6. Wafer-Scale Hierarchical Nanopillar Arrays Based on Au Masks and Reactive Ion Etching for Effective 3D SERS Substrate [O] . Dandan Men, Yingyi Wu, Chu Wang, 2018

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A High Performance and Cost Effective Molded Array Package Substrate

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