Electroplated Copper Pillar Feature Effects

摘要

Detailed analysis of copper pillar electroplating for different chemistries, deposition rates,rnand feature sizes.rnEconomical manufacturing of electroplated copper pillars requires maximizing therndeposition rate while achieving the coplanarity, flatness, and morphology required by thernoverall packaging process. Various aspects of the deposition are influenced by the resistrnpattern and the deposition rate. Experimental comparison of several different commercialrncopper chemistries is provided for copper pillars fabricated in 120 micron thick dry filmrnresist with features sizes from 60 to 120 microns diameter. Feature height co-planarityrnand pillar top surface shape are analyzed versus feature size and pitch for a range ofrndeposition rates.