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Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
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机译:能够电镀大型光刻胶的铜电镀浴和电镀方法定义的特征
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摘要
Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
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