The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses II. copper electroplates from sulfatic baths

Yu. Vegis; L. Simanavichus

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The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses II. copper electroplates from sulfatic baths

机译：库仑法确定厚度的溶液中电镀液的电化学行为II。硫酸盐浴镀铜

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《Защита Металлов》 |1999年第2期|共9页
作者
Yu. Vegis; L. Simanavichus;
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正文语种 rus
中图分类金属腐蚀与保护、金属表面处理;
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2. The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses. II. Copper electroplates from sulfate baths [J] . Yu. Vegis, L. Simanavichyus Protection of Metals . 1999,第2期

机译：电镀液在溶液中的电化学行为，用于电量分析法确定其厚度。二。硫酸盐浴镀铜
3. The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses II. copper electroplates from sulfatic baths [J] . Yu. Vegis, L. Simanavichus Защита Металлов . 1999,第2期

机译：电镀在厚度II的溶液中电镀的电化学行为II。铜电镀来自硫酸盐浴
4. The Electrochemical Behavior of Electroplates in Solutions for Coulometric Determination of Their Thicknesses.Ⅱ. Copper Electroplates from Sulfatic Baths [J] . Yu. Vegis, L. Simanavichus Protection of Metals . 1999,第2期

机译：库仑法测定其厚度的溶液中电化学行为。Ⅱ。硫酸盐浴镀铜
5. Spectroscopic and Electrochemical Analysis of Cu(I) Complex of Copper Sulfate Electroplating Solution and Evaluation of Plated Films [C] . T. Koga, C. Hirakawa, Y. Sakata, Meeting of the Electrochemical Society . 2017

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6. Microscopic and spectroscopic investigation of: I. Copper-additive systems in electroplating bath. II. Supported phospholipid bilayer systems. [D] . Feng, Zengqi Vivian. 2005

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机译：阳极氧化铝模板中来自单个电化学浴的多段Co54Ni46 / Co85Ni15纳米线的电镀和磁结构表征
8. Electroplating baths in transition and their problems for solution - Cases of stannous sulfate baths and alkaline zinc baths. [O] . Hiroyuki NEZU 1986

机译：电镀浴中的过渡浴及其解决方案 - 硫酸盐浴和碱性锌浴的病例。

The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses II. copper electroplates from sulfatic baths

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