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Using Pattern Enumeration to Accelerate Process Development and Ramp Yield

机译:使用模式枚举来加快过程开发和成品率

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During a new technology node process setup phase, foundries do not initially have enough product chip designs to conduct exhaustive process development. Different operational teams use manually designed simple test keys to set up their process flows and recipes. When the very first version of the design rule manual (DRM) is ready, foundries enter the process development phase where new experiment design data is manually created based on these design rules. However, these IP/test keys contain very uniform or simple design structures. This kind of design normally does not contain critical design structures or process unfriendly design patterns that pass design rule checks but are found to be less manufacturable. It is desired to have a method to generate exhaustive test patterns allowed by design rules at development stage to verify the gap of design rule and process. This paper presents a novel method of how to generate test key patterns which contain known problematic patterns as well as any constructs which designers could possibly draw based on current design rules. The enumerated test key patterns will contain the most critical design structures which are allowed by any particular design rule. A layout profiling method is used to do design chip analysis in order to find potential weak points on new incoming products so fab can take preemptive action to avoid yield loss. It can be achieved by comparing different products and leveraging the knowledge learned from previous manufactured chips to find possible yield detractors.
机译:在新技术节点工艺设置阶段,代工厂最初没有足够的产品芯片设计来进行详尽的工艺开发。不同的运营团队使用手动设计的简单测试键来设置其流程和配方。当设计规则手册(DRM)的第一个版本准备就绪时,代工厂进入过程开发阶段,在该阶段,将根据这些设计规则手动创建新的实验设计数据。但是,这些IP /测试密钥包含非常统一或简单的设计结构。这种设计通常不包含关键的设计结构或处理不合格的设计模式,这些设计模式可以通过设计规则检查,但制造难度较小。期望有一种在开发阶段生成设计规则允许的详尽测试模式的方法,以验证设计规则和过程的差距。本文提出了一种新的方法,该方法如何生成包含已知问题模式以及设计人员可以根据当前设计规则绘制的构造的测试关键图案。枚举的测试密钥模式将包含任何特定设计规则所允许的最关键的设计结构。布局分析方法用于进行设计芯片分析,以便发现新来产品的潜在弱点,因此晶圆厂可以采取先发制人的行动来避免良率损失。可以通过比较不同的产品并利用从先前制造的芯片中学到的知识来找到可能的减产因素来实现。

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