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Cleavage luminescence from silicon

机译:硅的切割发光

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This paper reports on further research into the structure and properties of the cleaved surfaces of silicon, using vacuum cleavage luminescence detection methods. The experiments involved detecting the luminescence produced by cleaving thin silicon plates within a high vacuum, by a process of converting the luminescence to an amplified electrical signal. The experiments were based on the assumption that surface cleavage and reconstruction may cause electrons to become excited, and the resulting recombination process which involves the combining of an electron in the conduction band with a hole in the valence band, would result in an emission of energy that would be detectable. This hypothesis was supported by simple calculations that predicted that every broken atomic bond on a silicon surface should radiate one photon, thus generating a strong detectable emission signal.
机译:本文报道了使用真空裂解发光检测方法对硅裂解表面的结构和性能进行进一步研究的报道。实验包括通过将发光硅片转换成放大的电信号的过程来检测在高真空下劈开薄硅片产生的发光。实验是基于这样的假设,即表面分裂和重建可能导致电子被激发,并且所产生的重组过程涉及导带中的电子与价带中的空穴的结合,将导致能量的发射。那将是可检测的。这一假设得到了简单计算的支持,该计算预测硅表面上每个断裂的原子键都应辐射一个光子,从而产生可检测的强发射信号。

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