首页> 外文会议>Conference on Smart Electronics, MEMS, BioMEMS, and Nanotechnology; 20040315-20040318; San Diego,CA; US >Development of compact phase shifters on silicon for monolithic integration of voltage controllers
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Development of compact phase shifters on silicon for monolithic integration of voltage controllers

机译:硅上紧凑型移相器的开发,用于电压控制器的单片集成

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A ferroelectric thin film RF phase shifter on silicon has been designed and developed with the implementation of polysilicon and BST thin film layers on small device area (8 mm~2) and fabrication processes fully compatible with current silicon IC technology. The design of a bilateral interdigital coplanar waveguide (BI-CPW) phase shifter is analyzed. This new design has shown a phase shift of 180° at 25 GHz with efficient use of a (Ba,Sr)TiO_3 thin film in the bilateral interdigital finger section. Inherent insertion loss and DC current leakage caused by conductivity of silicon substrate have been investigated. Due to the implementation of polysilicon thin film on silicon, insertion loss was controlled below 6.7 dB and signal dissipation with bias increase was not observed. It is shown that the polysilicon trap layer helped to reduce surface charge accumulation on the silicon surface.
机译:通过在较小的器件面积(8 mm〜2)上实现多晶硅和BST薄膜层的实现以及与当前硅IC技术完全兼容的制造工艺,已经设计和开发了硅上的铁电薄膜RF相移器。分析了双边叉指共面波导(BI-CPW)移相器的设计。这项新设计显示了在25 GHz下180°的相移,并在双指指间有效使用了(Ba,Sr)TiO_3薄膜。研究了由硅衬底的导电性引起的固有插入损耗和直流电流泄漏。由于在硅上实施了多晶硅薄膜,插入损耗被控制在6.7 dB以下,并且未观察到随偏置增加的信号耗散。结果表明,多晶硅陷阱层有助于减少硅表面的表面电荷积累。

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