Next-Generation MicroChannel Coolers

摘要

A next-generation microchannel cooler has been developed for packaging laser diode arrays that eliminates many of the problems associated with typical copper-based cooling designs.The coolers are built on well-established Low-Temperature Cofired Ceramic technology and provide excellent thermal performance. They do not require the use of deionized water.This work highlights the strengths of the new cooler technology. The results of a long-term, high-flow-rate test which demonstrates the excellent erosion resistance of these coolers are presented. Three devices have been tested for 2500 hours at a flow rate of 0.25 GPM and show minimal signs of erosion. This data is compared to a similar test conducted with copper coolers.Several design parameters are also addressed for the ceramic coolers. The available form and fit characteristics are addressed, as is the custom-configurable nature of the devices.