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Toward very large format infrared detector arrays

机译:迈向超大幅面红外探测器阵列

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Mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 1024×1024 pixel InGaAs/GaAs/AlGaAs based quantum well infrared photodetector (QWIP) focal planes have been demonstrated with excellent imaging performance. The MWIR QWIP detector array has demonstrated a noise equivalent differential temperature (NEΔT) of 17 mK at a 95K operating temperature with f/2.5 optics at 300K background and the LWIR detector array has demonstrated a NEAT of 13 mK at a 70K operating temperature with the same optical and background conditions as the MWIR detector array after the subtraction of system noise. Both MWIR and LWIR focal planes have shown background limited performance (BLIP) at 90K and 70K operating temperatures respectively, with similar optical and background conditions. It is well known that III-V compound semiconductor materials such as GaAs, InP, etc. are easy to grow and process into devices. In addition, III-V compound semiconductors are available in large diameter wafers, up to 8-inches. Thus, III-V compound semiconductor based infrared focal plane technologies such as QWIP, InSb, and strain layer superlattices (SLS) are potential candidates for the development of large format focal planes such as 4096×4096 pixels and larger. In this paper, we will discuss the possibility of extending the infrared detector array size up to 16 megapixels.
机译:已经证明基于中波长红外(MWIR)和长波长红外(LWIR)1024×1024像素InGaAs / GaAs / AlGaAs量子阱红外光电探测器(QWIP)焦平面具有出色的成像性能。 MWIR QWIP检测器阵列在f / 2.5光学元件在300K背景下的情况下,在95K工作温度下的等效噪声温差(NEΔT)为17 mK,而LWIR检测器阵列在70K工作温度下的噪声等效差温(NEEAT)为13 mK。减去系统噪声后,光学和背景条件与MWIR探测器阵列相同。 MWIR和LWIR焦平面在相似的光学和背景条件下,分别显示了在90K和70K工作温度下的背景受限性能(BLIP)。众所周知,III-V族化合物半导体材料如GaAs,InP等易于生长并加工成器件。此外,III-V型化合物半导体可用于最大8英寸的大直径晶圆中。因此,基于III-V化合物半导体的红外焦平面技术(例如QWIP,InSb和应变层超晶格(SLS))是发展大型焦平面(例如4096×4096像素或更大)的潜在候选者。在本文中,我们将讨论将红外探测器阵列尺寸扩展到16兆像素的可能性。

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