Optical interferometry investigation of internal stress and opto-mechanical characteristics of silicon oxynitride thin films fabricated by PECVD

摘要

The full-field interferometry is very well suited for evaluation of micromechanical and material properties of microsystems. In this paper, we presented a Twyman-Green interferometer for MEMS/MOEMS testing. The measurements of out-of-plan displacements of special silicon membranes with thin film of SiO_xN_y deposited by PECVD enable the analysis of opto-mechanical properties.