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Deposition and utilization of nano-multilayered brazing filler systems designed for melting point depression

机译:用于降低熔点的纳米多层钎料系统的沉积和利用

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摘要

In this article the preparation and utilization of nano-structured composite films as advanced alternative to eutectic Ag-Cu braze foils are described. The aim is to obtain a system with the same composition but with melting point depression for brazing heat sensitive materials (e.g. ultra-fine grained alloys). Our approach involves the preparation and optimization by sputter deposition of multilayer films with Ag-Cu layers (<12nm) alternated by carbon diffusion barrier layers (<10nm), whose role is to maintain the metallic braze material confined in the nano-size in order to achieve the melting point depression. Films with 20 to 200 repetitions have been produced in both laboratory scale and industrial facilities. It is found that the deposition process and the quality of the films are influenced by substrate temperature, chamber pressure, number of Ag-Cu/C repetitions, and deposition time. With optimized conditions we could obtain films having a melting point depression of 50℃ compared to the bulk eutectic alloy, as confirmed by high temperature XRD measurements. The nano-multilayer structure before and after brazing, thickness and composition have been characterized by TEM, SEM, EDX, X-ray diffraction and ellipsometry. It is found that the layers of eutectic Ag-Cu are nano-crystalline and the carbon barrier layers are amorphous, and both have a controlled thickness and full density throughout the whole film. Brazing tests of steel 1.4301 with 4μm thick nano-multilayer film as braze filler were performed in vacuum. The brazing test demonstrated that the brazing filler extracted from the nano-multilayers wets the steel substrate, however further optimization is in progress in order to achieve joints with quality matching industrial standards.
机译:在本文中,描述了纳米结构复合膜的制备和利用,作为共晶Ag-Cu钎焊箔的高级替代品。目的是获得用于钎焊热敏材料(例如超细晶粒合金)的具有相同组成但熔点降低的系统。我们的方法涉及通过溅射沉积Ag-Cu层(<12nm)和碳扩散阻挡层(<10nm)交替的多层膜来进行制备和优化,其作用是将金属钎焊材料保持在纳米尺寸内实现熔点降低。在实验室规模和工业设施中已生产了20到200个重复的胶片。已经发现,沉积过程和膜的质量受衬底温度,腔室压力,Ag-Cu / C重复次数和沉积时间影响。通过高温XRD测量证实,在最佳条件下,与块状低共熔合金相比,我们可以得到熔点降低50℃的薄膜。通过TEM,SEM,EDX,X射线衍射和椭偏仪对钎焊前后的纳米多层结构,厚度和成分进行了表征。发现共晶Ag-Cu的层是纳米晶体的,并且碳阻挡层是非晶的,并且两者在整个膜中都具有受控的厚度和全密度。在真空中对厚度为4μm的纳米多层膜作为钎料的1.4301钢进行了钎焊试验。钎焊测试表明,从纳米多层材料中提取的钎焊填料润湿了钢基材,但是正在进行进一步优化,以实现质量与工业标准相匹配的接头。

著录项

  • 来源
    《Brazing and soldering. 》|2012年|p.162-168|共7页
  • 会议地点 Las Vegas NV(US);Las Vegas NV(US)
  • 作者单位

    Empa, Swiss Federal Laboratories for Materials Science and Technology, 8600 Dubendorf, Switzerland;

    Empa, Swiss Federal Laboratories for Materials Science and Technology, 8600 Dubendorf, Switzerland;

    Empa, Swiss Federal Laboratories for Materials Science and Technology, 8600 Dubendorf, Switzerland;

    Empa, Swiss Federal Laboratories for Materials Science and Technology, 8600 Dubendorf, Switzerland;

    Empa, Swiss Federal Laboratories for Materials Science and Technology, 8600 Dubendorf, Switzerland;

    Institute of Materials Engineering TU Dortmund, Dortmund, Germany;

    Institute of Materials Engineering TU Dortmund, Dortmund, Germany;

    Institute of Materials Engineering TU Dortmund, Dortmund, Germany;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 焊接、金属切割及金属粘接 ; 焊接、金属切割及金属粘接 ;
  • 关键词

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