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Effects of wet-POA with various conditions on 4H-SiC m-face MOS interface properties

机译:不同条件下湿POA对4H-SiC m面MOS界面性能的影响

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Wet oxidation of SiC often results in significantly different MOS interface properties from dry oxidation [1,2]. We demonstrated on 4H-SiC Si-face, that the combination of dry oxidation and post-oxidation annealing in wet ambience (wet-POA) has a positive impact on MOSFET mobility [3]. For m-face, we also reported the reduction of MOS interface state density (D_(it)) by the same approach [4], but the impact of the selection of wet-POA conditions has not been clarified. In this research, we systematically investigated the effects of wet-POA with various conditions on m-face, focusing on Dit and bias stress instability.
机译:SiC的湿式氧化通常会导致MOS界面特性与干式氧化明显不同[1,2]。我们在4H-SiC Si面上证明,在湿润环境(wet-POA)中进行干氧化和后氧化退火的组合会对MOSFET迁移率产生积极影响[3]。对于m面,我们还报告了通过相同方法降低MOS界面状态密度(D_(it))[4],但尚未阐明选择湿POA条件的影响。在这项研究中,我们系统地研究了各种条件下湿POA对m面的影响,重点是Dit和偏置应力的不稳定性。

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