首页> 外文会议>Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20060425-27; Vancouver(CA) >Development of AlGaN/GaN High Power and High Frequency HFETs under NEDO's Japanese National Project
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Development of AlGaN/GaN High Power and High Frequency HFETs under NEDO's Japanese National Project

机译:NEDO日本国家项目开发的AlGaN / GaN高功率和高频HFET

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摘要

NEDO's Japanese national project on high power and high frequency nitride device is overviewed. Studies on correlation between crystal defects and device performances, electric field and thermal distribution in the device under operating conditions are demonstrated. Excellent CW RF output power of 230 W from a single chip and 371 W peak saturation power from an amplifier composed of paralleled HFET die are achieved at 2 GHz from Recessed FP gate structure. With a development of dual FP gate HFET, a state-of-the-art combination of 160 W output power and a 17.5 linear gain are realized at 2 GHz. At 30 GHz, 5.8 W CW operation are observed from T-gate HFET.
机译:概述了NEDO在日本的国家大功率和高频氮化物设备项目。证明了在操作条件下晶体缺陷与器件性能,电场和器件中的热分布之间的相关性的研究。嵌入式FP栅极结构在2 GHz时可实现单芯片230 W的出色CW RF输出功率和并联HFET芯片组成的放大器的371 W峰值饱和功率。随着双FP栅极HFET的发展,在2 GHz时可实现160 W输出功率和17.5线性增益的最新组合。在30 GHz下,从T栅极HFET观察到5.8 W CW操作。

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