Damage-Free Dicing of SiC Wafers by Water-Jet-Guided Laser

摘要

Since several years, the water-jet-guided laser technology has been used for a wide range of precision applications, including wafer dicing. It has proven its capacities to process not only silicon, but also more brittle semiconductor materials such as GaAs or low-k wafers. It has recently been tested on another compound material, which is known for its hardness: SiC. Compared to abrasive sawing, the water-jet-guided laser offers higher speed for the same quality at reduced running costs, as there is no blade wear.