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DFM for Defect-Free DSA Hole Shrink Process

机译:DFM用于无缺陷的DSA孔收缩工艺

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摘要

Application of the directed self-assembly (DSA) of block copolymer (PS-b-PMMA) to the hole shrink process has gained large attention because of the low cost and the potential for sub-lithographic patterning of contact, via and cut masks (Ref. and references therein). In order to realize the DSA hole shrink process for manufacturing, however, one still has to resolve a few critical issues such as morphological defects and placement errors. The morphological defect here indicates the PS residual layer lying between the vertical PMMA cylinder and the substrate, which prevents the PMMA cylinder from touching to the bottom surface. Such underlying defects cannot be observed by conventional approach with the top-down SEM images. In this study, we have utilized a simplified model, so-called the Ohta-Kawasaki (OK) model to optimize the DSA hole shrink process. The advantages of the OK model are considerably low computational expense and reasonable accuracy. First, we demonstrated that the OK model could indeed predict complicated, three-dimensional morphologies of the diblock copolymer in the pre-patterned hole. All the results were computed within one minute, and they were reasonably comparable to those obtained from the self-consistent field theory (SCFT). Then, we calibrated the model parameters with the cross-sectional TEM images, minimizing the errors between the simulated thickness of PS residual layer and the experimental data. The calibrated model was used for the optimization of the guide hole shape and for the exploration of the multi-cylinder case.
机译:嵌段共聚物(PS-b-PMMA)的定向自组装(DSA)在孔收缩过程中的应用引起了广泛的关注,因为其成本低廉,并且可能对接触,过孔和切割掩模进行亚光刻图案化(参考文献和其中的参考文献)。然而,为了实现用于制造的DSA孔收缩工艺,仍然必须解决一些关键问题,例如形态缺陷和放置错误。这里的形态缺陷表明PS残留层位于垂直的PMMA圆柱体和基材之间,从而阻止了PMMA圆柱体接触底面。此类常规缺陷无法通过常规方法使用自顶向下的SEM图像进行观察。在这项研究中,我们利用了简化的模型,即所谓的Ohta-Kawasaki(OK)模型来优化DSA孔的收缩过程。 OK模型的优点是相当低的计算费用和合理的准确性。首先,我们证明OK模型确实可以预测预图案化孔中二嵌段共聚物的复杂三维形态。所有结果均在一分钟之内计算出来,并且与从自洽场理论(SCFT)获得的结果相当地可比。然后,我们使用横截面TEM图像对模型参数进行校准,以最小化PS残余层的模拟厚度与实验数据之间的误差。校准后的模型用于优化导向孔的形状和探索多缸壳体。

著录项

  • 来源
    《Alternative lithographic technologies VI》|2014年|90491K.1-90491K.8|共8页
  • 会议地点 San Jose CA(US)
  • 作者单位

    Department of Chemical Engineering, Kyoto University, Nishikyo-ku, Kyoto, Japan, 615-8510;

    Center for the Promotion of Interdisciplinary Education and Research, Kyoto University, Sakyo-ku, Kyoto, 606-8501, Japan;

    Department of Chemical Engineering, Kyoto University, Nishikyo-ku, Kyoto, Japan, 615-8510;

    Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;

    Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;

    Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;

    Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;

    Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;

    Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    DSA; Block Copolymers; Defects; Contact Hole; Shrink Process; Simulations; Model;

    机译:DSA;嵌段共聚物缺陷;接触孔收缩过程;模拟;模型;

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