Department of Chemical Engineering, Kyoto University, Nishikyo-ku, Kyoto, Japan, 615-8510;
Center for the Promotion of Interdisciplinary Education and Research, Kyoto University, Sakyo-ku, Kyoto, 606-8501, Japan;
Department of Chemical Engineering, Kyoto University, Nishikyo-ku, Kyoto, Japan, 615-8510;
Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;
Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;
Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;
Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;
Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;
Center for Semiconductor Research Development, Toshiba Corporation, 1 Komukai Toshiba, Saiwai, Kawasaki, 212-8583, Japan;
DSA; Block Copolymers; Defects; Contact Hole; Shrink Process; Simulations; Model;
机译:三维研究化学和几何形状对DSA孔收缩过程的影响
机译:DSA接触孔收缩工艺的电气过孔率
机译:DSA接触孔收缩工艺的电气过孔率
机译:从三个角度研究化学和几何形状对DSA孔收缩过程的影响
机译:使用ERP和fMRI研究习得的熟练程度和年龄对神经组织进行句法处理的影响。
机译:视觉处理孔和无孔刺激的分离:功能磁共振成像研究
机译:电气通过链条产量进行DSA接触孔收缩过程