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Advancing Microsystem Technologies ThroughElectroplated Nanostructures

机译:通过电化纳米结构推进微系统技术

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Factors affecting reliability and performance are the main concerns when dealing with micro-systemrncomponents / devices with continuously shrinking external dimensions. In particular,rnmicrostructural non-uniformities leading to materials property variations across the microcom-ponentrnhave presented major challenges. However, recent developments in the field of electro-platedrnnanocrystalline materials can offer an avenue to address many of these technical difficul-ties.rnIn this paper, the deficiencies of metallic microsystem components currently in use are ad-dressed,rnfollowed by a comparison which shows how nano-electroplated microcomponents canrnalleviate these problems. Materials properties enhancements that are achievable as a result ofrnhaving nanostructured microcomponents will be discussed. The effects of grain size reductionrnon several specific performance indicators such as elastic energy storage capacity and wear resis-tancernwill be examined.
机译:当处理外部尺寸不断缩小的微型系统组件/设备时,影响可靠性和性能的因素是主要问题。特别地,导致整个微组件中材料特性变化的微观结构不均匀性提出了重大挑战。然而,电镀金刚石晶体材料领域的最新发展可以为解决这些技术难题提供一个途径。本文对当前使用的金属微系统组件的缺陷进行了修正,随后进行了比较,结果表明纳米电镀微组件如何缓解这些问题。将讨论由于具有纳米结构的微组件而可实现的材料性能增强。将考察晶粒尺寸减小对几个具体性能指标的影响,例如弹性储能能力和耐磨性。

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