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Elimination of Photoresist Linewidth Slimming by Fluorination

机译:通过氟化消除光刻胶线宽

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Typically resist performance has lagged behind exposure tools as new, shorter wavelengths are introduced in the never-ending industry quest to print smaller features. Over time, however, the performance improves until it matches or exceeds that of the resists used in the previous wavelength node; 193 nm resists have not been the exception. Their resolution and stability has improved but one issue that remains is linewidth slimming. This phenomenon consists in a reduction of resist features when the they are exposed to an electron beam in an scanning electron microscope during linewidth metrology. Although this phenomenon has been well described and reasonably well understood, no solution exists to eliminate this problem. In this paper we show linewidth slimming can be significantly reduced by fluorinating the resist after the relief image has been developed, keeping the lithographic dimensions unchanged.
机译:通常,抗蚀剂的性能落后于曝光工具,因为在永无止境的行业追求印刷更小的特征的过程中引入了新的更短的波长。但是,随着时间的流逝,性能会不断提高,直到达到或超过先前波长节点中使用的抗蚀剂为止。 193 nm抗蚀剂也不例外。它们的分辨率和稳定性有所提高,但是线宽变薄仍然是一个问题。这种现象包括在线宽度量过程中将抗蚀剂特征暴露在扫描电子显微镜中的电子束中时,抗蚀剂特征减少。尽管已经很好地描述了这种现象并对其进行了合理的理解,但是没有解决方案可以消除此问题。在本文中,我们显示了在凸版图像显影后,通过氟化抗蚀剂可以显着减少线宽变薄,并保持光刻尺寸不变。

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