DESIGN OF TRANSDUCER AND PACKAGE AT THE SAME TIME

摘要

The early effort of MEMS sensor development was focused mainly on the transducer: designing and manufacturing a mechanical device that could convert a physical input into an electrical signal using traditional semiconductor processes. With the rapid advancement in MEMS technologies, MEMS packaging is becoming increasingly critical and plays a major role in the successful commercialization of a MEMS product. Freescale has adopted the philosophy of concurrent transducer and package designs to facilitate the rapid introduction of sensor products into the market. This paper presents a sub-modeling procedure that allows the modeling and simulation of a transducer and a package seamless at the same time.