Super-lattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics

摘要

Solid-state cooling technologies using advanced superlattice thermoelectric materials are likely to provide not only near-term solutions for the hot-spots but also scalable refrigeration solutions for the entire chip. We discuss our development efforts with the superlattice thermoelectric technology for advanced microprocessor thermal management. We also discuss the development of similar technologies for application in the thermal management of optoelectronic components. The performance of small footprint thermoelectric modules fabricated using the thin film superlattice materials are discussed. We have begun early reliability studies on the superlattice materials, devices, and modules and the early results are positive. Advanced reliability studies using full Mil-spec and Telecordia-like power cycling are being undertaken for full commercial implementation of such advanced thermoelectric components.