首页> 外文会议>Advances in Electronic Packaging 2005 pt.C >CFD ANALYSES OF HEAT SINKS FOR CPU COOLING WITH FLUENT
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CFD ANALYSES OF HEAT SINKS FOR CPU COOLING WITH FLUENT

机译:用于散热的CPU散热的CFD分析

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In this study, forced cooling of heat sinks mounted on CPUs was investigated. Heat sink effectiveness, effect of turbulence models, effect of radiation heat transfer and different heat sink geometries were numerically analyzed by commercially available computational fluid dynamics softwares Icepak and Fluent. The numerical results were compared with the experimental data and they were in good agreement. Conjugate heat transfer is simulated for all the electronic cards and packages by solving Navier-Stokes equations. Grid independent, well converged and well posed models were run and the results were compared. The best heat sink geometry is selected and it is modified in order to have lower maximum temperature distribution in the heat sink.
机译:在这项研究中,对安装在CPU上的散热器的强制冷却进行了研究。通过商用计算流体动力学软件Icepak和Fluent对散热器的有效性,湍流模型的影响,辐射传热的影响以及不同的散热器几何形状进行了数值分析。将数值结果与实验数据进行比较,结果吻合良好。通过求解Navier-Stokes方程,可以模拟所有电子卡和包装的共轭传热。运行独立于网格的,良好收敛的和适合的模型,并对结果进行比较。选择最佳的散热器几何形状并对其进行修改,以降低散热器中的最大温度分布。

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