Microelectronic component e.g. CPU, cooling system for computer, has heat sink dispensing waste heat over cooling ribs to ambient air, where heat sink and component are positioned independent of printed circuit board by cables

摘要

The system has a heat sink (1) formed by a part of a device housing (6) and dispensing waste heat over cooling ribs to ambient air. A microelectronic component (2) is fastened from inwardly at the heat sink in a heat conducting manner. A cable (3) includes a plug-in connection for connecting a printed circuit board (5) with the microelectronic component. The heat sink and the microelectronic components are positioned independent of the circuit board by the cables.