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Detecting arcing events in semiconductor manufacturing equipment

机译:检测半导体制造设备中的电弧事件

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Bipolar arcs require a high voltage difference between two closely spaced points. As an example; if there is excessive deposition or contamination on the deposition and or cover ring in a physical vapor deposition tool (PVD) tool, a DC bipolar arc can occur leading to ablation of underlying materials, wafer breakage or chamber damage caused by the discharge. In some cases these incidents are not identified until numerous wafers have been processed. Therefore it is essential to identify arcing at the time of the event. In this paper, we address a problem for arc detection in a PVD chamber. The electrostatic chuck (ESC) critical parameter(s) are captured with 1000Hz sampling frequency and wavelet transforms are used to isolate arcs from the raw data. This methodology can easily be implemented on other plasma chamber types.
机译:双极电弧需要在两个紧密间隔的点之间具有较高的电压差。举个例子;如果物理气相沉积工具(PVD)工具中的沉积物和/或盖环上有过多的沉积物或污染,则可能会发生DC双极电弧,从而导致下层材料烧蚀,晶片破裂或由放电引起的腔室损坏。在某些情况下,直到处理完多个晶片后,才能确定这些事件。因此,必须在事件发生时识别电弧。在本文中,我们解决了PVD室中电弧检测的问题。静电卡盘(ESC)关键参数以1000Hz采样频率捕获,小波变换用于将电弧与原始数据隔离。这种方法可以很容易地在其他等离子腔室类型上实现。

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