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Using selective voltage binning to maximize yield

机译:使用选择性电压装仓以最大化产量

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摘要

Yield loss associated with leakage screens is increasing as products migrate to technologies with thinner gate oxide and more aggressive lithography. Product competitiveness requires meeting low power and when products have exhausted design options, tighter than 3 sigma fast leakage screens are implemented to reduce power which can result in significant yield loss. Selective Voltage Binning (SVB) provides a way to interlock a lower operating voltage in the system with process window information so that faster parts can be run in the system at a lower voltage avoiding the yield loss associated with custom leakage screens
机译:随着产品迁移到栅极氧化层更薄,光刻技术更先进的技术中,与泄漏屏相关的良率损失正在增加。产品竞争力要求满足低功耗要求,并且当产品用尽设计选项时,要采用比3 sigma紧密的快速泄漏滤网以降低功耗,这可能会导致良率损失。选择性电压合并(SVB)提供了一种将系统中较低的工作电压与过程窗口信息互锁的方法,以便更快的零件可以在较低的电压下在系统中运行,从而避免了与定制泄漏屏有关的良率损失

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