Low-k wafer scribing using water jet-guided laser technology with 10 ns lasers

机译：使用10 ns激光器的水射流引导激光技术进行低k晶圆划片

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摘要

This paper presents the latest results of low-k wafer scribing using short pulse lasers in combination with water jet-guided laser technology.

机译：本文介绍了结合短脉冲激光和水射流引导激光技术进行低k晶圆划刻的最新结果。

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来源
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》|2009年|115-118|共4页
会议地点 Berlin(DE);Berlin(DE)
作者
Pauchard A.; Obi S.; Lee K.; Richerzhagen B.;
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作者单位

Chemin de la Dent d'Oche, Synova SA, Ecublens, Switzerland;

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laser beam cutting; permittivity; semiconductor technology; water jet cutting; low-k wafer scribing; short pulse lasers; water jet-guided laser technology;

机译：激光切割;介电常数;半导体技术;水射流切割;低k晶圆划片;短脉冲激光器;水射流引导激光技术;

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专利

1. Implementation of Short-Pulse Lasers for Wafer Scribing and Grooving Applications [J] . Mathilde Gobet, Samuel Obi, Micha.l Pavius, Journal of Laser Micro/Nanoengineering . 2010,第1期

机译：用于晶片划线和开槽应用的短脉冲激光器的实现
2. Cost-Effective, Transfer-Free, Flexible Resistive Random Access Memory Using Laser-Scribed Reduced Graphene Oxide Patterning Technology [J] . He Tian, Hong-Yu Chen, Tian-Ling Ren, Nano letters . 2014,第6期

机译：使用激光划刻的还原氧化石墨烯图案化技术的经济高效，无转移，灵活的电阻式随机存取存储器
3. innovation and fabrication of 5.5 generation image- patterned translucent photovoltaic module by using laser scribing technology [J] . Shui-Yang Lien, Chia-Hsun Hsu, Yu-Chih Ou Progress in photovoltaics . 2013,第3期

机译：激光划片技术对5.5代图像图案半透明光伏组件的创新与制造
4. Low-k wafer scribing using water jet-guided laser technology with 10 ns lasers [C] . A. Pauchard, S. Obi, K. Lee, IEEE/SEMI Advanced Semiconductor Manufacturing Conference . 2009

机译：利用水喷射引导激光技术使用10 ns激光器的低k晶圆剪辑
5. Novel 1.3-micron high-speed directly modulated semiconductor laser device designs and the development of wafer bonding technology for compliant-substrate fabrication. [D] . Greenberg, Joseph. 2000

机译：新型1.3微米高速直接调制半导体激光器件设计以及用于顺应性衬底制造的晶圆键合技术的发展。
6. Experimental Analysis of Kerf Taper Angle in Cutting Process of Sugar Palm Fiber Reinforced Unsaturated Polyester Composites with Laser Beam and Abrasive Water Jet Cutting Technologies [O] . Fathi Masoud, S. M. Sapuan, Mohd Khairol Anuar Mohd Ariffin, 2021

机译：激光梁和磨料水射流切削技术糖棕榈纤维增强不饱和聚酯复合材料切割过程中Kerf锥角的实验分析
7. Implementation of Short-Pulse Lasers for Wafer Scribing and Grooving Applications [O] . Mathilde Gobet, Samuel Obi, Michaël Pavius, 2015

机译：用于晶圆划线和切槽应用的短脉冲激光器的实现
8. Technology of Laser Formed Interactions for Wafer-Scale Integration. [R] . Chapman, G. H., Canter, J. M., Cohen, S. S. 1989

机译：晶圆级集成激光成形相互作用技术。

Low-k wafer scribing using water jet-guided laser technology with 10 ns lasers

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