首页> 外文会议>Adhesion Society Annual Meeting; 20050213-16; Mobile,AL(US) >USING ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY FOR HEALTH MONITORING OF COMPOSITE-COMPOSITE AND ALUMINUM-COMPOSITE BONDS
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USING ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY FOR HEALTH MONITORING OF COMPOSITE-COMPOSITE AND ALUMINUM-COMPOSITE BONDS

机译:使用电化学阻抗谱对复合材料和铝复合材料的健康状况进行监测

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Electrochemical impedance spectroscopy (EIS) measurements were taken of CFRP and GFRP lap shear specimens during exposure to 95% relative humidity at 50℃, 70℃, and 90℃. Periodically, the lap shear specimens were pulled to determine the degradation of bond strength during hygrothermal aging. The low-frequency impedance correlated well with bond strength of the lap shear specimens exposed to high humidity. The changes to the impedance spectra and the decrease to the adhesive strength were both caused by moisture absorption by the adhesive. Comparison of the rate of impedance changes and strength degradation suggest that moisture absorption was the limiting factor in the deterioration of bond properties.
机译:在50℃,70℃和90℃的95%相对湿度下,对CFRP和GFRP搭接剪切试样进行了电化学阻抗谱(EIS)测量。定期拉动搭接剪切试样以确定湿热老化过程中粘结强度的下降。低频阻抗与暴露在高湿度下的搭接剪切试样的粘结强度密切相关。阻抗谱的变化和粘合强度的降低均由粘合剂吸收水分引起。阻抗变化率和强度降低率的比较表明,吸湿是粘结性能下降的限制因素。

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