Immersion Tin a Proven Final Finish for Printed Circuit Boards providing Reliable Solderability and Marginal Formation of Tin-Whiskers

摘要

Tin is known as ideal corrosion protection and solderability preservative for copper since a long time. Immersion tin processes are known since decades. When we started to develop a process as final finish for printed circuit boards we were however surprised that only limited knowledge was available about the mechanism of immersion tin plating, the best practice for an industrial process and the behaviour of the tin deposits.