首页> 外文会议>9th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2001), Sep 30-Oct 3, 2001, S. Tecla, Italy >Structural and Photoluminescence Properties of H~+ Ion-Implanted Silicon-on-lnsulator Structures Formed by Hydrogen Slicing
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Structural and Photoluminescence Properties of H~+ Ion-Implanted Silicon-on-lnsulator Structures Formed by Hydrogen Slicing

机译:氢切片形成的H〜+离子注入绝缘体上硅结构的结构和光致发光性质

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摘要

H~+ ion implanted SOI structures formed by hydrogen ion slicing have been investigated by SIMS, Raman spectroscopy and photoluminescence (PL). After implantation the wafers have been heat-treated by either furnace annealing (FA) or rapid thermal annealing (RTA). It has been found that implantation of (1 - 3) x 10~(17) H~+/cm~2 results in the formation of the amorphous Si layer (a-Si) inside silicon film on insulator. Structural transformations in a-Si depended on the annealing conditions. FA led to crystallization of a-Si and to the formation of monocrystalline silicon films. RTA results in the formation of the layers containing a high density of Si nanocrystals. A comparison of the Raman measurements with the PL data allows to conclude that PL bands obtained near 420 and 500 nm are not associated with the radiative recombination in Si nanocrystals
机译:通过SIMS,拉曼光谱和光致发光(PL)研究了通过氢离子切片形成的H +离子注入SOI结构。注入后,晶片已通过炉内退火(FA)或快速热退火(RTA)进行了热处理。已经发现,注入(1-3)×10〜(17)H〜+ / cm〜2会导致在绝缘体上的硅膜内部形成非晶硅层(a-Si)。非晶硅中的结构转变取决于退火条件。 FA导致a-Si结晶并形成单晶硅膜。 RTA导致形成包含高密度的Si纳米晶体的层。拉曼测量结果与PL数据的比较可以得出结论,在420和500 nm附近获得的PL谱带与Si纳米晶体中的辐射复合无关。

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