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On the Mechanism of Defect Suppression in Nitrogen-Doped Silicon Single Crystals

机译:氮掺杂硅单晶缺陷抑制机理的研究

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摘要

Floating zone grown crystals were investigated with regard to the impact of nitrogen and oxygen doping on the density/size distribution of vacancy aggregates (voids/COP). The analysis of the experimental results is based on the recently proposed model that the suppression of vacancy and Si interstitial aggregation in silicon proceeds via N_2 + V = N_2V and N_2V + I = N_2, respectively. In presence of significant amounts of oxygen in the range of 3 - 8xl0~(17) at/cm~3, the formation of N_2 is strongly reduced by the reaction 2NO = N_2 + 2O_i. At lower temperatures, the equilibrium of the reaction shifts to the right hand side and N_2V complexes can form again. Depending on the temperature at which a sufficient N_2 concentration builds up, the aggregation temperature of vacancies and, hence, the density/size distribution of voids varies. It is shown that the experimental findings are in qualitative accordance with the predictions of the proposed model, but additional effects have to be considered for a quantitative analysis.
机译:关于氮和氧掺杂对空位聚集体的密度/尺寸分布(空隙/ COP)的影响,研究了漂浮区生长的晶体。对实验结果的分析基于最近提出的模型,即通过N_2 + V = N_2V和N_2V + I = N_2分别抑制硅中的空位和Si间隙聚集。在3-8x10〜(17)at / cm〜3范围内存在大量氧气时,反应2NO = N_2 + 2O_i会强烈还原N_2的形成。在较低的温度下,反应的平衡向右移动,可以再次形成N_2V配合物。取决于建立足够的N_2浓度的温度,空位的聚集温度以及空隙的密度/尺寸分布会发生变化。结果表明,实验结果与所提出模型的预测定性一致,但定量分析必须考虑其他影响。

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