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Copper-Defect and Copper-Impurity Interactions in Silicon

机译:硅中的铜缺陷和铜杂质相互作用

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The key predictions of ab-initio Hartree-Fock (HF) calculations for copper in silicon clusters are reviewed. Preliminary results of ab-initio molecular-dynamics simulations in periodic supercells, based on density-functional (DF) theory with atomic-like basis sets are given. These calculations are performed in periodic supercells containing 64 or 128 host atoms and a varying number of k points. The electronic configuration of interstitial copper predicted by the DF calculations is very similar to the HF one. In a vacancy, copper forms four Cu ― Si covalent bonds. In a divacancy, Cu moves along the <111> direction toward the center of the void and becomes 6-fold coordinated. The interactions between substitutional copper and interstitial hydrogen are obtained from dynamic and static runs. Hydrogen traps at Cu_s without forming Si-H bonds. Instead, copper becomes 5-, 6-, then 7-fold coordinated as one, two, or three H interstitials bind to it.
机译:综述了硅团簇中铜的从头算Hartree-Fock(HF)计算的关键预测。给出了基于密度泛函(DF)理论和类原子基集的周期性超级电池从头算分子动力学模拟的初步结果。这些计算是在包含64个或128个主体原子和变化的k点数量的周期性超级单元中执行的。通过DF计算预测的间隙铜的电子结构与HF非常相似。在空位中,铜形成四个Cu - Si共价键。在空位中,Cu沿着<111>方向向空隙的中心移动,并成为6倍配位。铜和间隙氢之间的相互作用是从动态和静态运行中获得的。氢在Cu_s处捕获而没有形成Si-H键。取而代之的是,铜会变成5、6,然后7倍的配位,因为一个,两个或三个H间隙键合到它。

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