Research on Film Thickness Uniformity of Sputtering Deposition on Planar Substrate

摘要

Magnetron sputtering coating is one of the indispensable technologies of modem industry, which is widely applied in electronics, construction, automobiles and other industries, especially the large area deposition, and more and more attention is paid to thin film thickness uniformity, deposition ratio, utilization ratio of target material and other problems in coating industry. As one of the most important parameters for testing sputtering process, the study on the related issues of thin film uniformity is of great theoretical and practical value. The fundamental theory on deposition of sputtering coating is analyzed based on existing theories, and the model of deposition flux that is composed of fast- and slow-moving particles is applied to the rectangular planar magnetron sputtering target Through the application of Matlab software and the numerical calculation of thin film deposition uniformity of a rectangular planar magnetron sputtering target, it is easy to come to the following conclusions: the thickness uniformity will reduce with the increase of target-substrate distance and with the decrease of erosion zone of the target ends. When the erosion zone of the target ends increases to some extend, the thin film thickness uniformity will become higher with the increase of target-substrate distance and then become lower. There are two tendencies for thin film thickness uniformity with the increase of length-width ratio of target erosion zone, that is, it will become a little lower when the length is a constant, or become higher when the width is a constant And the thin film thickness uniformity will become lower with the decrease of power and the increase of gas temperature. The deposition rate will become higher with the decrease of target-substrate distance, or the increase of power and gas temperature.