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Research on Thin Film Thickness Uniformity for Deposition of Rectangular Planar Sputtering Target

机译：矩形平面溅射靶沉积的薄膜厚度均匀性研究

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Zhang Yichen; Song Qingzhu; Sun Zhulai;
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年度 2012
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1. Effect of sputter deposited Zn precursor film thickness and annealing time on the properties of Cu2ZnSnS4 thin films deposited by sequential reactive sputtering of metal targets [J] . Singh Om Pal, Muhunthan Nadarajah, Gour Kuldeep Singh, Materials science in semiconductor processing . 2016,第Null期

机译：溅射沉积Zn前驱体膜厚和退火时间对金属靶顺序反应溅射沉积Cu2ZnSnS4薄膜性能的影响
2. Deposition of Co-Cr films with excellent c-axis orientation and uniform thickness for rigid disks using compact sputtering apparatus [J] . Kitamoto Y., Abe M. IEEE Transactions on Magnetics . 1996,第5期

机译：使用紧凑型溅射设备沉积具有出色c轴取向和均匀厚度的Co-Cr膜用于刚性磁盘
3. Effect of Thickness on Properties of Copper Thin Films Growth on Glass by DC Planar Magnetron Sputtering [J] . A. Hojabri, F. Hajakbari, M. A. Moghri Moazzen, Journal of Nanostructures . 2012,第1期

机译：厚度对直流平面磁控溅射玻璃上铜薄膜生长性能的影响
4. Numerical analysis of thickness uniformity of thin film deposited by rectangular planar target [C] . Guo Zhu, Jiangping Sun, Xiongxiong Guo, International Conference on Electronic Packaging Technology . 2017

机译：矩形平面靶沉积薄膜厚度均匀性的数值分析
5. Characterization of sputtered iridium oxide thin films on planar and laser micro-structured platinum thin film surfaces for neural stimulation applications. [D] . Thanawala, Sachin. 2006

机译：用于神经刺激应用的平面和激光微结构铂薄膜表面上溅射的氧化铱薄膜的表征。
6. Effect of Target Composition and Sputtering Deposition Parameters on the Functional Properties of Nitrogenized Ag-Permalloy Flexible Thin Films Deposited on Polymer Substrates [O] . Waheed Khan, Qun Wang, Xin Jin 2018

机译：靶成分和溅射沉积参数对沉积在聚合物基底上的氮化银-坡莫合金柔性薄膜功能性能的影响
7. Stoichiometric, epitaxial ZrB2 thin films with low oxygen-content deposited by magnetron sputtering from a compound target: Effects of deposition temperature and sputtering power [O] . Tengdelius, Lina, Greczynski, Grzegorz, Chubarov, Mikhail, 2015

机译：磁控溅射从复合靶材上沉积的低氧化学计量外延ZrB2薄膜：沉积温度和溅射功率的影响

Research on Thin Film Thickness Uniformity for Deposition of Rectangular Planar Sputtering Target

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