In Vehicle Infotainment and Advanced Driver Assistance Systems: Advantages of Knowledge-Based Qualification over Standard-Based Qualification for Solder Joint Reliability

摘要

In this paper, we proposed a novel approach of applying Knowledge-based Qualification (KBQ) to calculate temperature cycle (TC) requirements for Ball Grid Array (BGA)s in a given automotive electronics module. Realistic use (UC) condition temperature profiles were constructed by combining weather data, driver cabin environment, user behavior statistical data, and component thermal behavior. Individual package geometry, solder ball pin map and material properties were incorporated through Finite Element Analysis (FEA) modeling. Direct translation from use condition to KBQ test condition requirement was achieved by using a physics based damage metric - inelastic strain energy density (ISED). We compared KBQ results to Standard-based Qualification (SBQ) results for In Vehicle Infotainment (IVI) and Advanced Driver Assistance Systems (ADAS) automotive modules to demonstrate and explain why KBQ and SBQ differ and why SBQ requirements can be misleading. We also demonstrate how package geometry and material properties impact KBQ, while they are generally ignored by SBQ.