Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration

摘要

We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of untra-fine size, ultra-high density CNP. Multi-number of TEG dies with 7mm x 23mm size are bonded to an interposer wafer by a new hybrid bonding technology. A huge number of electrodes of 4,309,200 composed of scaled electrodes with 3μm diameter and 6μm pitch are formed in each TEG die. We confirmed for the first time that 4,309,200 electrodes per die are successfully connected in series with the joining yield of 100% due to ultra-high density CNP.