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The Fabrication and SEM Analysis of MEMS Sensor Chip on the Si-surface Modified by Porous Al2O3

机译:多孔Al2O3修饰Si表面MEMS传感器芯片的制备与SEM分析。

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摘要

The Si-surface of MEMS sensor based on Si is too smooth to combine with the sensitive material, making it difficult to produce the MEM gas sensor, in this paper, aimed at the problem, a method od porous Al2O3 modifing the Si-sufface is proposed to solve this problem. A layer of aluminum film is formed on the Si-surface through the magnetron sputtering technique, then porous microstructure Al2O3 ceramic film is fabricated by the electrochemical anodic oxidation, and the composite semiconductor gas-sensing material of polyaniline and hexadecachloro zinc phthalocyanine (ZnPcCl16) is permeated in the holes of the film by chemical synthesis. In this paper, the SEM morphologies of porous Al2O3 ceramic film, the section of Si substrate and gas-sensing material permeated .in the holes are analyzed, and the best technological parameters are obtaned.
机译:基于Si的MEMS传感器的Si表面太光滑,无法与敏感材料结合使用,因此难以生产MEM气体传感器。针对此问题,本文针对多孔Al2O3改性Si的方法进行了研究。建议解决这个问题。通过磁控溅射技术在Si表面形成一层铝膜,然后通过电化学阳极氧化制备多孔微结构的Al2O3陶瓷膜,得到聚苯胺和十六氯酞菁锌(ZnPcCl16)的复合半导体气敏材料。通过化学合成渗透到薄膜的孔中。本文分析了多孔Al2O3陶瓷膜的SEM形貌,Si衬底的截面和气敏材料在孔中的渗透情况,并获得了最佳工艺参数。

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