Aerogel and Porous Silicon MEMS for on-Chip Vacuum Packaging.

摘要

The goal of this project is to develop a versatile on-chip vacuum- package technology for surface-micromachined devices. The resulting on-chip encapsulation technology is expected to provide a low-cost, high performance packaging solution for a wide variety of surface micromachined devices, especially micro- and nano-resonators. Our approach is to cover the MEMS structures with a nano-porous membrane before releasing. Release etching is performed by liquid- or gas-phase etching through the permeable membrane. Sealing is achieved by depositing a metal or dielectric film directly on the nano-porous shell in vacuum. Two types of nano-porous materials are developed: thin-film aerogels and porous polysilicon (PPS).