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Stacking Fault Formation in Highly Doped 4H-SiC Epilayers during Annealing

机译:退火过程中高掺杂4H-SiC外延层中的堆垛层错形成

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Spontaneous stacking fault formation during annealing in n~+ 4H-SiC epilayers deposited on the n~- 4H-SiC substrates has been analyzed by conventional and high-resolution transmission electron microscopy (HRTEM). All faults were double layer Shockley faults formed by glide of partial dislocations on two neighboring basal planes. Ends of stacking faults were examined with high-resolution TEM. Approximately half of bounding partial dislocations had extra half planes extending into the substrate while the other half had half planes pointing toward epilayer. This observation is inconsistent with mechanical stress due to doping difference between epilayer and the substrate being the driving force of fault expansion. Formation of single Shockley stacking faults was also observed in n~+ 6H-SiC.
机译:已经通过常规的高分辨率透射电子显微镜(HRTEM)分析了在n〜+ 4H-SiC衬底上沉积的n〜+ 4H-SiC外延层中退火过程中的自发堆叠缺陷形成。所有的断层都是由两个相邻基面上部分位错滑移形成的双层肖克利断层。使用高分辨率TEM检查堆垛层错的末端。大约一半的边界部分位错具有延伸到基板中的额外半平面,而另一半具有指向外延层的半平面。由于外延层和衬底之间的掺杂差异是断层扩展的驱动力,因此该观察结果与机械应力不一致。在n〜+ 6H-SiC中也观察到了单个肖克利堆垛层错的形成。

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