首页> 外文会议>4th European Conference on Silicon Carbide and Related Materials (ECSCRM 2002); Sep 2-5, 2002; Linkoeping, Sweden >Study of the Wet Re-Oxidation Annealing of SiO_2/4H-SiC (0001) Interface Properties by AR-XPS Measurements
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Study of the Wet Re-Oxidation Annealing of SiO_2/4H-SiC (0001) Interface Properties by AR-XPS Measurements

机译:通过AR-XPS测量研究SiO_2 / 4H-SiC(0001)界面性质的湿式再氧化退火

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We have characterized the SiO_2/SiC system in terms of bonds and composition by angle-resolved X-ray photoelectron spectroscopy for two different oxidation processes: a standard oxidation, and a process which includes a re-oxidation step. Although the oxide is quite stoichiometric (Si~(4+) oxidation states) far away from the interface, the analyses revealed at the SiO_2/SiC boundary a complex transition layer containing "mixed" (Si-O-C) compounds. After the so-called re-oxidation procedure, we have observed a significant decrease (30%) of the Si bonds related to these (Si-O-C) species. From these results, the improvement of the electrical properties of SiO_2/SiC interface during the re-oxidation can now be clearly related to the reduction of the carbon products.
机译:我们已经通过角度分辨X射线光电子能谱对键合和组成进行了SiO_2 / SiC系统的表征,适用于两种不同的氧化过程:标准氧化和包括重氧化步骤的过程。尽管氧化物与界面之间的化学计量关系很理想(Si〜(4+)氧化态),但分析表明在SiO_2 / SiC边界处有一个复杂的过渡层,其中包含“混合”(Si-O-C)化合物。经过所谓的再氧化程序,我们已经观察到与这些(Si-O-C)物种相关的Si键显着减少(30%)。从这些结果可以看出,重新氧化过程中SiO_2 / SiC界面电性能的改善显然与碳产物的减少有关。

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