The Cleaning Effectiveness in Electronics Assembly Process

摘要

This paper deals with research and development of the cleaning process conditions regarding the efficiency ofrnpractical cleaning methods in the area of electronics assembly technologies, target the cleaning after lead-freernsoldering. Increased miniaturization, higher speeds and tighter board space highlights that need, as well asrnrequest for higher reliability, especially by some type of applications (automotive, medical, military etc.).rnCorrect adjustment of the cleaning equipment and cleaning process may save as the time as well materialsrnconsumption and costs. In this paper are discussed some parameters of cleaning process, especially cleaningrnmedium, including its optimal controlling and setting. The special test pattern on glass substrate were designedrnand realized to become a “scale” for measuring cleaning efficiency. This pattern was used for optimalrnarrangement and adjustment new cleaning equipments, which are developing in Pbt Roznov Company in thernCzech Republic [4]. Latest work is focused on cleaning medium controlling in the practical use. In more withrnintroduction of new environmental regulations (WEEE, RoHS) and also eco-design (EuP) rules the cleaningrnprocess becomes to be more and more important, not only for lead free soldering as well for various parts ofrntechnological processes.