Fraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany Phone: Tel. +493046403189, Fax +493046403158rnEmail: robert.erxleben@izm.fraunhofer.de;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany;
rnFraunhofer Institute of Reliability and Microintegration Gustav-Meyer-Allee 25, Berlin, Berlin 13355 Germany Technische Universit?t Berlin (Berlin Institute of Technology)rnStra?e des 17. Juni 135, 10623 Berlin, Germany;
planar transmission lines; microstrip; coplanar; stripline; attenuation;
机译:复合左,右手传输线的双频带微带至共面带状线威尔金森巴伦及其在双频带领结天线馈电中的应用
机译:薄聚合物基板上的通孔和无孔接地共面波导至微带过渡的比较研究
机译:锥形微带线向共面线过渡的梯形对数对数周期天线的研究
机译:高性能应用不同基板技术对不同基板技术的微带,带状线和共面线的比较研究
机译:共面带状线电路分析及其在滤波器,天线和无线电力传输中的应用。
机译:用于微带贴材天线电路的天然纤维/氧化镍/聚己内酯复合物的半柔性衬底的制备与表征微带应用
机译:通孔与通过无通过接地共面波导的比较研究薄聚合物基材上的微带转变