首页> 外文会议>3rd Pacific international conference on applications of lasers and optics 2008 (PICALO 2008) >SURFACE ROUGHNESS ANALYSIS AND IMPROVEMENT OF PMMA-BASED MICROFLUIDIC CHIP CHAMBER BY CO2 LASER CUTTING
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SURFACE ROUGHNESS ANALYSIS AND IMPROVEMENT OF PMMA-BASED MICROFLUIDIC CHIP CHAMBER BY CO2 LASER CUTTING

机译:CO2激光切割对PMMA基微流控芯片腔的表面粗糙度分析和改进

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We studied the surface roughness of chamber sidewall in the PMMA-base microfluidic chip which was cut with CW CO2 laser at different laser parameters and ambient temperature. Our observations show that the surface roughness is mostly resulted from the residues near the laser cutting edge,which are produced from bubble bursting. In order to improve the quality of the cut surface, we proposed to preheat PMMA plate to a suitable temperature before laser processing, and found that would obtain better surface roughness at 70°C~90°C. The best result in our experiment was Ra=100.86 nm when preheat PMMA plate to 85 °C in the water.
机译:我们研究了在不同的激光参数和环境温度下,用CW CO2激光切割的PMMA基微流控芯片中腔室侧壁的表面粗糙度。我们的观察表明,表面粗糙度主要是由于气泡破裂引起的激光切割边缘附近的残留物所致。为了提高切割表面的质量,我们建议在激光加工之前将PMMA板预热到合适的温度,发现在70°C〜90°C时可获得更好的表面粗糙度。当在水中将PMMA板预热到85°C时,我们实验的最佳结果是Ra = 100.86 nm。

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