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机译:基于CO_2激光切割的PMMA基微流控芯片腔室的表面粗糙度分析和改进
Institute of Laser Engineering, Beijing University of Technology, Beijing 100124, People's Republic of China;
Institute of Laser Engineering, Beijing University of Technology, Pingleyuan 100, Chaoyang District, Beijingl00124, China;
Institute of Laser Engineering, Beijing University of Technology, Beijing 100124, People's Republic of China;
Institute of Laser Engineering, Beijing University of Technology, Beijing 100124, People's Republic of China;
surface roughness; PMMA; microfluidic chip; CO_2 laser cutting;
机译:磨料水射流和CO_2激光束切割产生的钛表面粗糙度的测量和分析
机译:高功率CO_2激光切割AA5754铝合金在不同方面的表面粗糙度优化
机译:用Taguchi方法优化CO_2激光切割中的表面粗糙度
机译:CO2激光切割对PMMA基微流控芯片腔的表面粗糙度分析和改进
机译:通过激光辅助加工在金属切削中的微观结构预测以及可加工性和表面完整性的改善。
机译:激光辅助高速加工316不锈钢:水溶性Sago淀粉基切削液对表面粗糙度和工具磨损的影响
机译:使用负耙角切割力,芯片形成和表面粗糙度